Low Oxygen Clean Oven for Semiconductor Packaging 'SCO Series'
Maintain a stable oxygen concentration at a few ppm level throughout the processes of temperature rise, stabilization, and decline!
We would like to introduce our low-oxygen clean oven for semiconductor packaging, the "SCO Series." By placing the cooling water flow path outside the chamber, we have adopted a unique structure that does not retain water inside the chamber. This ensures extremely high safety while reducing installation space and system electrical capacity by 50% compared to conventional models (compared to our own devices). The SCO Series meets the industry's highest levels of temperature control, low oxygen concentration, and high cleanliness required in various thermal processing steps of advanced packaging manufacturing processes. 【Features】 ■ Compatible with large panels of 515×510mm ■ High-precision thermal processing up to 500℃ ■ Achieves low oxygen concentration control below 10ppm ■ Maintains cleanliness class 4 stably ■ Compatible with automatic doors and GEM communication *For more details, please download the PDF or feel free to contact us.
- Company：エスペック
- Price：Other
